1. Preface: with the development and progress of electronic technology, electronic products to the light, thin, small, personalization, high reliability, muti_function change has become an inevitable trend.And out of aluminum plate conform to this trend, the product with excellent heat resistance, machinability, dimensional stability and electrical performance in hybrid integrated circuit, automobiles, office automation, high-power electrical equipment, power equipment, and other fields has been widely applied in recent years.Aluminium base copper clad by Japanese sanyo company first invented in 1969, our country began in 1988, development and production of Edna, developed and mass production began in 2000 in order to adapt to the mass production, mass production, artificial this production specification.
2. Scope: this production specifications for the production of aluminium base copper clad introduces the whole process and specification, to ensure that the board in our production smoothly.
3. Process: cutting and drilling→ dry film optical imaging→check board→etching→ corrosion inspection→solder mask→character →green inspection→ HASL→aluminum surface treatment→impact→final inspection→packaging→shipment
4. Note:
4.1 aluminum sheet is expensive, should pay special attention to the standardization of operation in the process of production, put an end to scrap phenomenon caused by the non-standard operations.
4.2 each working procedure is operated operators must take put down gently, in order to avoid the plate and aluminum surface clean.
4.3 operators, each process should try to avoid hand contact with aluminum plate, the effective area after spray tin and process the board shall hold the edge, only when it is strictly prohibited to finger directly touch the board inside.
4.4 aluminum board belongs to the special board, should cause district attaches great importance to each process and its production supervisor, foreman, personal quality, guarantee the smooth plate in the process of production.
5. The special production process flow and parameters:
5.1 material cutting
5.1.1 strengthen incoming inspection (must use aluminum sheet metal surface has a protective film).
5.1.2 without baking plate after cutting.
5.1.3 light to take light put, pay attention to the protection of the aluminum surface (protective film).
5.2 drilling
5.2.1 drilling parameters and FR - 4 plate drilling parameters are the same.
5.2.2 aperture tolerance yan, 4 oz base Cu attention to control the generation of the beatles feng.
5.2.3 requires copper on the hole.
5.3 the dry film
5.3.1 incoming inspection: before grinding plate must be inspection on aluminum surface protective film, if there is any breakage, must be fastened with welan again after pretreatment.
5.3.2 grinding plate: only on copper surface for processing.
5.3.3 the paster: copper, aluminum surface shall be sticker.
Control grinding plate and the lamination time interval is less than 1 minute, ensure the paster temperature stability.
5.3.4 clappers: pay attention to the clappers precision.
5.3.5 exposure, exposure ruler: 7 ~ 9 have glue.
5.3.6 development: stress: 20 ~ 35 psi speed: 2.0 ~ 2.6 m/min, the operator must be careful operation, avoid the protective film and aluminum chafed below.
5.3 the dry film
5.3.1 incoming inspection: before grinding plate must be inspection on aluminum surface protective film, if there is any breakage, must be fastened with welan again after pretreatment.
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