FPC Applications

RFPC

FPC board, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates.

Since January 2011 flexible circuit orders have been up sharply in every category - aerospace, defense, energy, general industrial and, especially, in the medical electronics sector.

FPC circuits can bescreen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use.

Flex circuits are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring. A common application of flex circuits is in computer keyboards; most keyboards use flex circuits for the switch matrix. So actually we are very familiar with FPC circuits.

This website can provide you some images and more information about FPC circuit: http://www.wonderfulpcb.com/

Flexible circuits are found in industrial and medical devices where many interconnections are required in a compact package. Cellular telephones are another widespread example of flexible circuits.

Based on FPC technology a new circuit material develops very fast. That is rigid-flex printed circuit boards (RFPCs), in equipment used for rigid PCBs by utilizing new materials and process combinations. To reach higher packaging density at the PCB level, it is developed the technology with embedded active and passive components. However, in higher packaging density applications, the PCB-technology has to offer more flexibility to PCB-designers in order to effectively utilize space inside the electronic devices... That makes the birth of FPC circuits - different flexible PCB solutions are needed to achieve this goal.

The importance of establishing a brand

WDF-FPC-D-20,double sided,wonderfulpcb.com

When it comes to brands, we can throw you a lot of well-known brands. Life brand advertising can be seen everywhere. Brand has far exceeded the value of its own material values，it makes personal use of a brand has been upgraded to meet the psychological and spiritual values. Therefore, once a product brand success,the economic benefits it bring will be immeasurable. Thus, that  a company establish a brand is very important.

WDF give guests a good impression, firstly reflected in the brand name. WDF is Wonderful meaning, it is an English word that means wonderful. It Contains praise meaning and the feeling is very good. So the brand name already has been a success. Secondly, it is the quality of the product. The success of an enterprise is not only the surface of things, really you need to have something inside. That is the product. How it reflects the value of your product? Your products will give good feedback to customers, so that customers feel that the use of your product is assured. Therefore, product quality is the most important. When a customer using your product feel at ease then your road to success began. Customers will continue to give you the next order, and even introduce his colleagues to give you new orders. This is the only way you can sell a better product. Quality is a quantitative change to qualitative change process, when more and more people know about your product ，after that people will be more concerned about your brand. People in the procurement time, will regard you as a contrast to the object. This time, your brand will play its powerful features, to bring you more customers. Furtherly, brand promotion is the premise of the brand started. WDF wants to do big business, wants more foreign friends know our brand, then you need to make greater efforts in the promotion. At present our company through the exhibition, the Alibaba, Global Sources and corporate websites to do their own brand. The company has foreign language department and sales department of Russian, is a relatively large sales team. Therefore, this requires the joint efforts of all the staff: to continue to do the promotion on the platform, fight promotions, lead to more customer focus; salesman to enhance their professional level, to show your specialty to your the customer, quality departments to maintain close contact with the plant, and to make sure the quality and quantity completed on time. Through continuous accumulation, expanding our customer base and our product quality assurance. And then we can get better and better WDF fame. Last point is to do for the success of a brand is too important for a company. Because the brand effect will not only allow us to get more customers, which in turn allows the body in its employees have a proud sense, can stimulate the morale of everyone. Let us work together to bring   Wonderful  into every corner of the world and achieve everyone Millions dream.

PCB processes

Panelization is a procedure whereby a number of PCBs are grouped for manufacturing onto a larger board - the panel. Usually a panel consists of a single design but sometimes multiple designs are mixed on a single panel. There are two types of panels: assembly panels - often called arrays - and bare board manufacturing panels. The assembler often mount components on panels rather than single PCBs because this is efficient. The bare board manufactures always uses panels, not only for efficiency, but because of the requirements the plating process. Thus a manufacturing panel can consist of a grouping of individual PCBs or of arrays, depending on what must be delivered.

Chemical etching is usually done with ammonium persulfate or ferric chloride. For PTH (plated-through holes), additional steps of electroless deposition are done after the holes are drilled, then copper is electroplated to build up the thickness, the boards are screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be etched away.

The simplest method, used for small-scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to splash boards with etchant; the process has become commercially obsolete since it is not as fast as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles, and recirculated by pumps. Adjustment of the nozzle pattern, flow rate, temperature, and etchant composition gives predictable control of etching rates and high production rates.

As more copper is consumed from the boards, the etchant becomes saturated and less effective; different etchants have different capacities for copper, with some as high as 150 grams of copper per litre of solution. In commercial use, etchants can be regenerated to restore their activity, and the dissolved copper recovered and sold. Small-scale etching requires attention to disposal of used etchant, which is corrosive and toxic due to its metal content.

The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurs when etchant attacks the thin edge of copper under the resist; this can reduce conductor widths and cause open-circuits. Careful control of etch time is required to prevent undercut. Where metallic plating is used as a resist, it can "overhang" which can cause short-circuits between adjacent traces when closely spaced. Overhang can be removed by wire-brushing the board after etching.

If you need expert PCB services, please feel free to contact me, wonderful02@wonderfulpcb.com

Test Development Services Fixtureless Test

     Rapidly increasing complexity of PCBA manufacturer makes visual defect detection nearly impossible. Receiving a PCBA without electrical verification can significantly delay design verification of prototypes and system integration of low volume PCBAs. The cost and time to develop fixture based in-circuit testing (ICT) is prohibitive in the prototype stage and the investment in ICT or functional test is tough to justify for low volume manufacturing.
     Vergent Products offers a solution – flying probe fixtureless testing based on parametric test of each component. Fixtureless test development is low cost and very fast. There is no costly fixture to design and build. Tests are generated from CAD information which enables a high degree of test coverage and flexibility.
     Testing your low volume products and prototypes allows for detection and repair of electrical defects such as wrong parts, reversed parts, missing parts, solder opens, and major solder defects. Fixtureless testing can help you improve your products time-to-market by achieving the highest possible quality levels early in the product life cycle. Fixtureless test allows your engineers to focus their efforts on prototype design verification instead of debugging process issues. 
     Fixtureless testers use a flexible moving probe system. Multiple probes are automatically moved very rapidly to various test points on the assembly – hence the name: “flying probe”. These probes are capable of static DC voltage, current, resistance, capacitance, and inductance measurements. Test points are derived from CAD data to ensure accuracy and to maximize test coverage.
     Here is a brief description of some of the features of the Seica S40 has to offer:
•Four independently moving topside contact probes; Test speeds up to 12 – 20 tests per second
•Test area up to 16” x 20”
•Positioning repeatability accuracy of +/- 0.12mils; Minimum positioning resolution of +- 0.20 mils in each axes
•Minimum probe contact pitch of 0.12 mils between probe pins; Minimum pad size of 4.0 mils
•Maximum component height of 0.9 inches including board thickness
•Automated optical inspection, in-circuit programming, and boundary scan functional test capable (optional)
     Component measuring ranges [minimum resolution]:
Voltage generator low voltage DC/AC 2 channels +- 1mV to +- 10V (+-0.1%)
Voltage generator high voltage DC/AC 1 channel +- 25mV to +- 100V (+-0.2%)
Voltage measurement DC/AC 1 channel +- 200uV to +- 100V
Current generator low current DC/AC 1 channel +- 1na to +- 0.5A (+-0.1%)
Current measurement DC/AC 1 channel +- 3na to +- 0.5A
Resistance measurement 1 channel .1 Ω to 100MΩ
Capacitance measurement 1 channel 1pF to 1F
Inductance measurement 1 channel 1uH to 1H
Zener Diode 1 channel up to 100V
Waveform generator Sine, Triangle, Arbitrary 1 channel 1 Hz to 3 mHz (+- 1 mHz) +- 10V max
Waveform generator Sine, Triangle, Arbitrary 1 channel 1 Hz to 10 kHz (+-10 mHz) +- 100V max
Frequency measurement 1 channel 0.1 Hz to 10 mHz
Digital embedded channel 1 channel +-12V 500ma @ 10Mhz
For best turn around time on board test program generation and debug please provide:
Schematics
ASCII CAD data
Raw card
Populated board

The test development NRE charges are very reasonable.

FPC assembly Pallets features

I would like to introduce the comparison between Magnetic reflow pallets and silica gel plate.

A. Stability: magnetic reflow pallet in magnetic state to even out the FPC, as the physical process, magnetic may increase or decrease according to request, don't change due to factors such as temperature, time, relatively stable.Silica gel plate adopt chemistry, will change under different temperature or Time or other condition, which lack of stability. Especially in the use of a certain period of time after a drop in viscosity, and not clean viscosity decreased during us, which cause FPC substrate deformation while crossing the reflow soldering and affect the welding quality.

B. Usage Life: magnetic reflow tray used in magnetic material and working principle of physical process, are high temperature resistant material,
As long as it's not  destroyed by man or at accident situation, it can be permanent online.  state can use permanent damage and accidents.Silica gel plate in use process, USES the chemical process,In use process, it will be aging of due to silicone materials, including Japan's material, no more than 1000 times return.The cost is very high.

C. Quality: magnetic reflow pallet at work on FPC insulating protection at the same time, FPC won’ t be destroyed when workman pick up the FPC.Silica gel plate in use process to ensure the smooth of FPC, has certain viscosity,and will stick to FPC, which will be difficulty for picking up FPC and may cause FPC deformation.

1.Comparison between Magnetic reflow pallets and normal plate

A.Quality: magnetic reflow pallet, because of FPC flat surface cause from the steel, reflow soldering will be reduced during FPC flow, which can guarantee the stability of welding quality, reduce adverse.Ordinary tray can only be used with high temperature tape around the FPC, after reflow soldering
, which easy to cause deformation to the middle part of FPC, tin water to overflow, cause bad welding, which will affect the quality. At the same time, magnetic
Reflow soldering tray can reduce some difficulty, like can avoid the high temperature stick to FPC lead to hard FPC being picked up or FPC deformation.

B. Cost: magnetic reflow soldering tray, convenient to use,  reduce prework workers, and the person to take off the tape after reflow soldering, at meanwhile, can reduce the use amount of the high temperature tape. Investment is bigger at first time to magnetic reflow soldering tray, however, it has cost advantage for mass production.

Gold Finger PCB

Edge connector with Nickel plating (Ni) and gold (Au), suitable to wear style application for a full-featured product and customized quote. Tied using industry standard protocols allow electric plating nickel plating and the African Union in the etching.

With your Au selection, a standard 30-degree bevel will be added to your edge connector. We can also bevel at 15 or 45 degrees upon request. For multi-layer boards please insure adequate inner layer back set for the bevels. Gold Finger is the memory and the memory slots on the connection between the parts, all the signals are transmitted through the finger to. Gold finger by numerous golden composed of conductive contacts, but also because of its gold-plated conductive surface such as a finger-like arrangement of the contacts, so called "Gold finger." Gold finger is actually in the CCL through a special process and then covered with a layer of gold, because gold is very strong antioxidant activity, but also very strong conductivity. But because of the expensive price of gold is currently more memory are used instead of tin from the 90s of last century began to spread solder material, the current motherboard, memory and graphics cards and other devices "Gold finger" are almost always used tin material, only some high-performance server/workstation accessories will continue to use gold-plated contact point approach, the price of natural cheap.

Finger edge connectors are usually inserted into the mating groove to ease the connector. When this happens, the heart of the aircraft may be exposed copper if they do not quit this advantage fully. We will take you back to the inner layer of copper is higher than shown on the right in order to avoid exposure to copper in this location. Copper can cause direct exposure to all terminals short connector into it.

Wonderfulpcb is an experienced Aluminum pcb,Flexible pcb,Rigid-flex pcb,Multilayer pcb,PCBA manufacturer,PCB board manufacturer,provide various of printed circuit boards at competitive prices

Aluminum board process-A

the production of aluminum pcb specification
1. Preface: with the development and progress of electronic technology, electronic products to the light, thin, small, personalization, high reliability, muti_function change has become an inevitable trend.And out of aluminum plate conform to this trend, the product with excellent heat resistance, machinability, dimensional stability and electrical performance in hybrid integrated circuit, automobiles, office automation, high-power electrical equipment, power equipment, and other fields has been widely applied in recent years.Aluminium base copper clad by Japanese sanyo company first invented in 1969, our country began in 1988, development and production of Edna, developed and mass production began in 2000 in order to adapt to the mass production, mass production, artificial this production specification.     
2. Scope: this production specifications for the production of aluminium base copper clad introduces the whole process and specification, to ensure that the board in our production smoothly.    
3. Process: cutting and drilling→ dry film optical imaging→check board→etching→ corrosion inspection→solder mask→character →green inspection→ HASL→aluminum surface treatment→impact→final inspection→packaging→shipment   
4. Note:    
4.1 aluminum sheet is expensive, should pay special attention to the standardization of operation in the process of production, put an end to scrap phenomenon caused by the non-standard operations.   
4.2 each working procedure is operated operators must take put down gently, in order to avoid the plate and aluminum surface clean.
4.3 operators, each process should try to avoid hand contact with aluminum plate, the effective area after spray tin and process the board shall hold the edge, only when it is strictly prohibited to finger directly touch the board inside.
4.4 aluminum board belongs to the special board, should cause district attaches great importance to each process and its production supervisor, foreman, personal quality, guarantee the smooth plate in the process of production.    
5. The special production process flow and parameters:   
5.1 material cutting
5.1.1 strengthen incoming inspection (must use aluminum sheet metal surface has a protective film).
5.1.2 without baking plate after cutting.
5.1.3 light to take light put, pay attention to the protection of the aluminum surface (protective film).
 5.2 drilling
5.2.1 drilling parameters and FR - 4 plate drilling parameters are the same.    
5.2.2 aperture tolerance yan, 4 oz base Cu attention to control the generation of the beatles feng.
5.2.3 requires copper on the hole.
5.3 the dry film
5.3.1 incoming inspection: before grinding plate must be inspection on aluminum surface protective film, if there is any breakage, must be fastened with welan again after pretreatment.     
5.3.2 grinding plate: only on copper surface for processing.
5.3.3 the paster: copper, aluminum surface shall be sticker.
Control grinding plate and the lamination time interval is less than 1 minute, ensure the paster temperature stability.
5.3.4 clappers: pay attention to the clappers precision.
5.3.5 exposure, exposure ruler: 7 ~ 9 have glue.
5.3.6 development: stress: 20 ~ 35 psi speed: 2.0 ~ 2.6 m/min, the operator must be careful operation, avoid the protective film and aluminum chafed below.
5.3 the dry film
5.3.1 incoming inspection: before grinding plate must be inspection on aluminum surface protective film, if there is any breakage, must be fastened with welan again after pretreatment.